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4 Years
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| Brand Name : | PHOENIX |
| Model Number : | 3030 |
| Certification : | LM80 CE ROHS |
| Price : | Negotiation |
| Payment Terms : | Western Union, MoneyGram, T/T |
| Supply Ability : | 800KK PER MONTH |
| Delivery Time : | 7-10 DAYS |
Application Introduction:
In the electronic industry, backlight is a form of lighting, which is often used in LCD display. The difference between backlight and front light is that the backlight shines from the side or back, while the front light shines from the front as the name suggests. They are used to increase the illumination in low light source environment and the brightness on computer monitors and LCD screens to produce light in a similar way to CRT displays.
ODM Full Spectrum Cob RGB LED Chip 60-65LM 2835 3v
Quick details:]
| Input Voltage(V): | 3V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 2835 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 60-65lm |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | Red /green /blue |
| Power: | 0.5W |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Packing bag: | 220*240nm |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | Household appliances and traffic lights |
| Package Type: | Suface Mount Package |
| Forward Current: | 150MA |
| Size: | 2.8*3.5*0.65mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure:
Product Specification:
| Item | Specification | Material | Quantity |
| Chip | InGaN | InGaN | 2 in 1 |
| Reflector | White | PCT | |
| Frame | C194 | Silver-Plated Copper | |
| Gold wire | 0.9mil | Alloy | |
| Phosphor | Yellow | YAG | |
| Encapsulant | MilkyWhite | Resin | |
| Carrier tape | According to EIA 481-1A specs | Conductive black tape | 4000pcs per reel |
| Reel | According to EIA 481-1A specs | Conductive black | 4000pcs per reel |
| Label | Repsn standard | Paper | |
| Packing bag | 220x240mm | Aluminum laminated bag/ no-zipper | One reel one bag |
| Carton | Repsn standard | Paper | Non-specified |
Absolute Maximum Ratings:
| Item | Symbol | Absolute Maximum Ratings | Unit |
| Forward Current | IF | 150 | mA |
| Reverse Voltage | Vr | 5 | V |
| Pulsed Forward Current | IFP* | 180 | mA |
| Power dissipation | PD | 0.5 | W |
| Operating Temperature | TOP | -40~85 | ℃ |
| Storage Temperature | TST | -40~85 | ℃ |
| Electrostatic Discharge | ESD | 2000(HBM) | V |
| Junction Temperature | Tj | 120 | ℃ |
| LED Thermal resistance | Rth s-j | 33 | ℃/W |
Typical Electro-Optical characteristics curves:
LED Reliability Test List:
| Test Item | Test Conditions | Standard | Qty(Pcs) | Ac/Re |
| Life Test | 25℃,1000Hrs@150mA | / | 20 | 0/1 |
| High Temperature | 85℃,1000Hrs@150mA | / | 20 | 0/1 |
| Low Temperature | -40℃,1000Hrs@150mA | / | 20 | 0/1 |
| High Humidity Heat | 85℃,85%RH, 1000Hrs@150mA | / | 20 | 0/1 |
| Low Temperature Storage | -40℃,1000Hrs | JEITA ED-4701 200 202 | 20 | 0/1 |
| High Temperature Storage | 100℃,1000Hrs | JEITA ED-4701 200 201 | 20 | 0/1 |
| Temperature Cycle | (-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min) | JEITA ED-4701 100 105 | 20 | 0/1 |
| Thermal Shock | -40'C(15mins) --100'C(15mins),changing time <5mins ,300C | MIL-STD-202G | 20 | 0/1 |
Pulse Life Test | Tp=1ms,DC=0.1,D=Tp/T @ 3×150mA | / | 20 | 0/1 |
| ESD Test(HBM) | 2000V,200V/Step, Forward & Reverse Test both 3times | AEC (Q101-001) | 20 | 0/1 |
| Soldering Resistance | 260±5℃,10S,3times Pre-treatment 30℃,70%RH | JEITA ED-4701 300 302 | 20 | 0/1 |
| Reflow IV Decay | 260±5℃,10S,1time Pre-treatment 30℃,70%RH,168Hrs | / | 20 | 0/1 |
| Judgment Criteria | ||||
| Forward Voltage VF | VF Max-Increase < 1.1x | |||
| Reverse Current IR | IR Max-Increase < IRmax | |||
| Luminous Intensity IV | IV Decay < 40% | |||
※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours) | ||||
Packaging:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than
300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Handling Precautions :
Handle the component along the side surface by using forceps or
appropriate tools
Do not directly touch or handle the silicone lens surface. It may
damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may
scratch the silicone lens or damage the internal circuitry
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
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