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3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light

Phoenix (suzhou) electronic Co.,ltd
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    Buy cheap 3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light from wholesalers
     
    Buy cheap 3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light from wholesalers
    • Buy cheap 3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light from wholesalers
    • Buy cheap 3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light from wholesalers
    • Buy cheap 3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light from wholesalers

    3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light

    Ask Lasest Price
    Brand Name : PHOENIX
    Model Number : 2016
    Price : Negotiation
    Payment Terms : Western Union, MoneyGram, T/T
    Supply Ability : 400KK PER MONTH
    Delivery Time : 7-10 DAYS
    • Product Details
    • Company Profile

    3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light

    3V 60MA 0.2W 2016 20-30LM PPT SMD LED CHIP USED FOR LED STRIP

    Exterior decoration: daytime running light, fog light, turn signal light, rear combination light, license plate lighting, body lighting (such as grille and logo)
    Interior: map and interior dome lighting
    visualization:
    Portable lamp
    Display backlight
    lighting:
    Indoor, outdoor and architectural lighting
    Decorative and entertainment lighting
    Advertising lighting
    Signal lamp
    1.Feature:

    Viewing angle:120 deg

    Ø The materials of the LED dice is InGaN

    Ø 2.2mm*1.6mm*0.6mm

    Ø RoHS compliant lead-free soldering compatible


    2.Package Structure:

    Unit: mm Tolerance: +/-0.2mm


    Figure: 0.2W medium power thin series circuit diagram

    Tolerance: ±0.2mm unless otherwise noted

    Electrodes: Ag Plating Copper Alloy

    Encapsulating Resin: Silicon Resin

    Package: Heat-Resistant Polymer


    3.Electro-Optical Characteristics: (Each LED @ 60mA, Ta 25℃ )

    Product No.MaterialVF(V)ColorRAFlux(lm)
    minmaxCIE coordinates x, yminmax
    QT-2016ZW-1CSAZInGaN2.83.5Typ x=0.33, y=0.33808528

    4.Product Specification:


    ItemSpecificationMaterialQuantity
    ChipInGaNInGaN1 in 1
    ReflectorWhitePPA
    FrameC2680Silver-Plated Copper
    Gold wire0.9milAlloy
    PhosphorYellowYAG
    EncapsulantMilkyWhiteResin
    Carrier tapeAccording to EIA 481-1A specsConductive black tape4000pcs per reel
    ReelAccording to EIA 481-1A specsConductive black4000pcs per reel
    LabelRepsn standardPaper
    Packing bag220x240mmAluminum laminated bag/ no-zipperOne reel one bag
    CartonRepsn standardPaperNon-specified

    5.Absolute Maximum Ratings:


    ItemSymbolAbsolute Maximum RatingsUnit
    Forward CurrentIF60mA
    Reverse VoltageVr5V
    Pulsed Forward CurrentIFP*90mA
    Power dissipationPD0.2W
    Operating TemperatureTOP-40~85
    Storage TemperatureTST-40~85
    Electrostatic DischargeESD2000(HBM)V
    Junction TemperatureTj110
    LED Thermal resistanceRth s-j27℃/W

    6.Typical Electro-Optical characteristics curves:


    7.LED Reliability Test List:


    Test ItemTest ConditionsStandardQty(Pcs)
    Life Test25℃,1000Hrs@60mA/22
    High Temperature85℃,1000Hrs@60mA/22
    Low Temperature-40℃,1000Hrs@60mA/22
    High Humidity Heat

    85℃,85%RH,

    1000Hrs@60mA

    /22
    Low Temperature Storage-40℃,1000Hrs

    JEITA ED-4701

    200 202

    22
    High Temperature Storage100℃,1000Hrs

    JEITA ED-4701

    200 201

    22
    Temperature Cycle(-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing rate:3+/-0.6'C/min)

    JEITA ED-4701

    100 105

    22
    Thermal Shock-40'C(15mins) --100'C(15mins),changing time <5mins ,300CMIL-STD-202G22
    Pulse Life TestTp=1ms,DC=0.1,D=Tp/T @ 3×60mA,1000Hrs/22
    ESD Test(HBM)2000V,200V/Step, Forward & Reverse Test both 3times

    AEC

    (Q101-001)

    22
    Soldering Resistance

    260±5℃,10S,3times

    Pre-treatment 30℃,70%RH

    JEITA ED-4701

    300 302

    22
    Reflow IV Decay

    260±5℃,10S,1time

    Pre-treatment 30℃,70%RH,168Hrs

    /22
    Judgment Criteria
    Forward Voltage VFVF Max-Increase < 1.1x
    Reverse Current IRIR Max-Increase < IRmax
    Luminous Intensity IVIV Decay < 40%
    ※Solder ability test criteria:coverage is not less than 95%
    Note:Measurement shall be taken after the tested samples have been returned to normal ambient conditions (generally after two hours)

    8.Cautions:

    The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the

    Top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions Should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle,The pressure on the silicone resin should be proper.

    8.1:Soldering iron :

    8.1.1 When hand soldering, the temperature of the iron must less than 300℃ for 3 seconds.

    8.1.2 The hand solder should be done only one times

    8.2:SMT Reflow Soldering Instructions SMT:

    8.2.1 Reflow soldering should not be done more than two times;

    8.2.2 When soldering , do not put stress on the LEDs during heating;

    8.2.3 The recommended reflow soldering profile as following:


    8.3 Handling Precautions

    8.3.1Handle the component along the side surface by using forceps or appropriate tools;

    8.3.2 Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry;


    Quality 3V 2016 20-30LM AC Led Chip Led Smd Bead Chips Bulb Light for sale
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